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You are here: Home / PCB Products & Services / Asahi Kasei
AsahiKASEI E-Materials
sunfort-pallette
asahi-kasei-photoresist-cutaway_tiny

Asahi Kasei is a world leader in negative working Dry Film Photoresist products.

Asahi Kasei’s products are used in used in: PCB manufacturing, Chemical Milling, ITO Touch Screen, Semi-Conductor lithography applications.

Application Process SUNFORT™ product type
General PWB

     (Printed Wiring Board)
AQ-88(25, 30, 40,45) : acid tent & etch
AQ-96(30, 40): acid tent & etch for fine pattern
AQ-38(40, 50, 62): alkaline & acid tent & etch, electroplating
YQ-50SD: electroplating
PKG substrate
  (BGA/CSP/Flip Chip)
Subtractive AQ-209A, AQ-58(15, 20)
SAP, MSAP UFG-8(15, 20, 25), ADH-6(25)
FPC AQ-58(15, 20), AQ-209A
ENIG AQ-38(40, 50, 62)
Chemical Milling (metal etching) AQ-58(15, 20, 25)
For stainless steel etch: AQ-59 (15, 40) & AQ-38(40, 50, 62)
Direct Imaging i&h-line ADV-6(30, 35, 40, 50, 62), ADH-151 (fine pattern)
(M)SAP (i&h) ADH-6(25)
Copper Pillar & C4 Bump CX-40(80, 120), CX-70(120)
Touch Sensor Panel ATP-3(10, 15), AFS-152, AQ-209A

Basic properties of Direct Imagine Resist ADV-**6 series

Dry Film ADV-256 ADV-306 ADV-356 ADV-406 ADV-506 ADV-626
BP (30degC, 1%Na2CO3) 17sec. 20sec. 21sec. 25sec. 37sec. 45sec.
Exp. energy
(Step tablet by Stouffer 41)
18mj/cm2
22st.
18mJ/cm2
20st.
20mJ/cm2
22st.
20mJ/cm2
20st.
32mJ/cm2
21st.
40mJ/cm2
22st.
Resolution
(L/S=x/x, nega)
18um 20um 22um 24um 35um 40um
DF adhesion of
Isolated line
18um 20um 22um 22um 35um 45um
Application Acid Etch, -Tenting etching process -Copper/Tin
electroplating
Inner layer Outer layer

• ADV-**6 series have various resist thickness (1.0mil-2.5mil), show super high sensitivity and can use at i-line (355nm) and h-line (405nm) exposure.
• ADV-506 and 626 has been used for Copper/Tin electroplating processes for North American customers.

Basic properties of Direct Imagine Resist ADH-**6 series

Dry Film ADH-256
BP (30degC, 1%Na2CO3) 17sec.
Exp. energy
(Step tablet by Stouffer 41)
80mJ/cm2
23st.
Resolution
(L/S=x/x, nega)
10um
DF adhesion of isolated line 12um

• ADH-**6 series show super high resolution, adhesion and can use at i-line (355nm) and h-line (405nm) exposure.
• Suitable for Direct imaging – semi additive process (DI-SAP)

Development of Asahi Kasei’s Sunfort™ Dry Film Photoresist began in 1977 and the the product line was officially launched for sale in 1981. In 1986 Asahi Kasei founded the Resist Technology lab.

Between 1987 and 1997 the Fuji Coating Line doubled its production capacity. Between 1997 and 1999 Asahi Kasei continued growth by establishing its slitting plants in Taiwan.

In 2003, Asahi Kasei opened the Suzhou Coating plant, the largest dry film coating facility in the world. This was followed by the opening of the Changshu coating plant in 2013.

Today, Asahi Kasei’s SunForttm product continues to grow in popularity and application as more products are miniaturized.

"Competitively priced products with consistent quality and on time deliveries backed by 24/7 customer support…"

Contact Information

PCI Sales & Marketing

49 Pelham Rd
Salem, NH 03079

Phone: (603) 894-7070
Fax: (603) 894-7007
 

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