Asahi Kasei is a world leader in negative working Dry Film Photoresist products.
Asahi Kasei’s products are used in used in: PCB manufacturing, Chemical Milling, ITO Touch Screen, Semi-Conductor lithography applications.
| Application | Process | SUNFORT™ product type |
| General PWB (Printed Wiring Board) |
AQ-88(25, 30, 40,45) : acid tent & etch AQ-38(40, 50, 62): alkaline & acid tent & etch, electroplating |
|
| PKG substrate (BGA/CSP/Flip Chip) |
Subtractive | AQ-58(15, 20, 30) |
| SAP, MSAP | UFP-1(15,25,30,35,40) | |
| FPC | AKC-2(15,25,30) | |
| Chemical Milling (metal etching) | AKC-2(15,25,30) AQ-58(15,20), AQ-59(25,40) CX-40(80), CX-71(120,160,180,240,270.340) | |
| Direct Imaging | i&h-line | ADV-6(30, 40, 50, 62), ADV-8(25,35,40) |
| (M)SAP (i&h) | ADH-8(15,25,30,40) | |
| Copper Pillar & C4 Bump | CX-40(80), CX-71(120,160,180,240,270,340) | |
Basic properties of Direct Imagine Resist ADV-**6 series
| Dry Film | ADV-256 | ADV-306 | ADV-356 | ADV-406 | ADV-506 | ADV-626 |
| BP (30degC, 1%Na2CO3) | 17sec. | 20sec. | 21sec. | 25sec. | 37sec. | 45sec. |
| Exp. energy (Step tablet by Stouffer 41) |
18mj/cm2 22st. |
18mJ/cm2 20st. |
20mJ/cm2 22st. |
20mJ/cm2 20st. |
32mJ/cm2 21st. |
40mJ/cm2 22st. |
| Resolution (L/S=x/x, nega) |
18um | 20um | 22um | 24um | 35um | 40um |
| DF adhesion of Isolated line |
18um | 20um | 22um | 22um | 35um | 45um |
| Application | Acid Etch, -Tenting etching process | -Copper/Tin electroplating |
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| Inner layer | Outer layer | |||||
• ADV-**6 series have various resist thickness (1.0mil-2.5mil), show super high sensitivity and can use at i-line (355nm) and h-line (405nm) exposure.
• ADV-506 and 626 has been used for Copper/Tin electroplating processes for North American customers.
Basic properties of Direct Imagine Resist ADH-**6 series
| Dry Film | ADH-256 |
| BP (30degC, 1%Na2CO3) | 17sec. |
| Exp. energy (Step tablet by Stouffer 41) |
80mJ/cm2 23st. |
| Resolution (L/S=x/x, nega) |
10um |
| DF adhesion of isolated line | 12um |
• ADH-**6 series show super high resolution, adhesion and can use at i-line (355nm) and h-line (405nm) exposure.
• Suitable for Direct imaging – semi additive process (DI-SAP)
Development of Asahi Kasei’s Sunfort™ Dry Film Photoresist began in 1977 and the the product line was officially launched for sale in 1981. In 1986 Asahi Kasei founded the Resist Technology lab.
Between 1987 and 1997 the Fuji Coating Line doubled its production capacity. Between 1997 and 1999 Asahi Kasei continued growth by establishing its slitting plants in Taiwan.
In 2003, Asahi Kasei opened the Suzhou Coating plant, the largest dry film coating facility in the world. This was followed by the opening of the Changshu coating plant in 2013.
Today, Asahi Kasei’s SunForttm product continues to grow in popularity and application as more products are miniaturized.
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