| Dry Film Primary Resist: |
| Application for: |
Process |
SUNFORTtmproduct type |
|
| General PCB |
AQ-4088 (for acid etch & electro plate)
AQ-**38 (for alkaline etch), AQ-3088 (inner layer) |
| PKG substrate (BGA/CSP) |
Subtractive |
AQ-209A, AQ-1559, AQ-3096 |
| Semi-additive |
ASG series |
| FPC |
Single-side |
AQ-1558, AQ-1559, AQ-2078 |
| Double-side |
AQ-2559 |
| COF & TAB |
UFG-**5, UFG-**2, AQ-1559 |
| Electro plate of Nickel & Gold |
AQ-**86, AQ-**38, AQ-**58 |
| Lead Frame (chemical milling) |
Copper alloy |
AQ-**58, AQ-**59 |
| 42 alloy |
AQ-**58 |
| Stainless Steel |
AQ-**59, AQ-**58, AQ-**38 |
| Direct Imaging |
ADV-**1, ADH-**1, ADH-**2 |
| BUMP on wafer |
Silicone wafer |
CX-**40 |
| Flat panel Display (Plasma Display) |
Electrode |
AQ-**58 (ITO), ACP series (Al) |
| Sand Blast |
APD series |
|
| Solder Mask: |
- PSR-4000 Liquid Photoimageable Solder Mask
- PSR-9000 Flexible Liquid Photoimageable Solder Mask
- 2 Part Thermal Epoxy 401 & 501
- 1 Part UV Solder Mask
|
| Legend Inks: |
- 2 Part Epoxy Legend Ink
- UV 1 Part Legend Ink
- Available Colors: White, Black, Yellow
|
| Specialty Chemistry & Equipment: |
- Dry Film Strippers
- Defoamers
- Screen Cleaners
- Solder Mask Strippers
- Hot Air Levelling Fluxes
- Tin & Tin Lead Strippers
- Developers
- Micro Etch
- IR Fluxes
- Solder Conditioners
- Flux Controller
|
| Direct Metalization Process: |
- Solution Technology Systems’ Patented Process Reduces Hazardous Chemistry, Process Time, and Process Costs
|
| Liquid Photoimageable Solder Mask Process Equipment: |
- DSA-2000, 2010, Spray Systems
- Tunnel Cure & Tack Dry Ovens
|
| Horizontal Solder Levelling Epuipment: |
- Unicote Model #175 & #350
|
